Component mounting device, method, and system that controls head based on degree of malfunction
US11307567B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Feb 22, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A management device for managing a component mounter that mounts components onto a substrate using some of constituent elements each selected from one of constituent element groups each including the constituent elements. One group is a nozzle group including nozzles. The device includes: a true displacement amount calculator that calculates, for each target component which is the component, a true amount of displacement which is a sum of (i) an amount of pickup displacement being an amount of displacement between the target component and a target nozzle being one of the nozzles and picks up the target component and (ii) an amount of correction being an amount of offset of a position of the target nozzle when picking up the target component; and a statistical processor that performs parameter estimation for a predetermined statistical model using the true amount to calculate a degree of malfunction of each constituent element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.