Method of post optical proximity correction (OPC) printing verification by machine learning
US11308256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jun 22, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Implementations of the disclosure provide a method of fabricating an integrated circuit (IC). The method includes receiving an IC design layout; performing optical proximity correction (OPC) process to the IC design layout to produce a corrected IC design layout; and verifying the corrected IC design layout using a machine learning algorithm. The post OPC verification includes using the machine learning algorithm to identify one or more features of the corrected IC design layout; comparing the one or more identified features to a database comprising a plurality of features; and verifying the corrected IC design layout based on labels in the database associated with the plurality of features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.