Semiconductor package with wettable slot structures
US11309237B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
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Key dates
| Filing date | Sep 27, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jul 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/561
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.