Package structure for semiconductor device, and semiconductor device
US11309439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2018 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Nov 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure comprises a metal plate (20) where a slot is formed, a ceramic piece (60), and a metal heat sink (70) welded onto the back surface of the ceramic piece (60). The ceramic piece (60) and the metal heat sink (70) are vertically inserted into the slot and welded to the metal plate (20). A semiconductor and a matching circuit may be disposed on the metal heat sink (70). The ceramic piece (60) replaces a glass seal; metalized interconnection is provided inside the ceramic piece (60) for fabricating a metalized pattern having complex connection relations, and the electrical interconnection is more flexible. In the package structure, metalized wiring is carried out by using the ceramic piece. Compared with round lead machining, higher precision is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.