Metal circuit on polymer composite substrate surface and method for manufacturing the same
US11310916B1 · kind B1 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.