Chun-Lung Wu
16Patents
3h-index
24Co-inventors
60Inventor score
Filing activity: Mar 24, 1993 → Jan 9, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9352331B1 | Filters for paramagnetic and diamagnetic substances | Chemistry; Metallurgy | 5 | Active |
| US10475723B1 | IGBT heat dissipation structure | Electricity | 4 | Active |
| US7908469B2 | Method for executing power on self test on a computer system and updating SMBIOS information partially | Physics | 3 | Active |
| US5373409A | Disk for cleaning magnetic head of disk drive | Physics | 3 | Expired |
| US7490318B2 | Computer platform operating system compatibility management method and system | Physics | 2 | Active |
| US10015907B2 | Heat dissipating device | Electricity | 1 | Active |
| US11965702B1 | Low pressure drop automotive liquid-cooling heat dissipation plate and enclosed automotive liquid-cooling cooler having the same | Electricity | 0 | Active |
| US10861768B2 | IGBT module with improved heat dissipation structure | Electricity | 0 | Active |
| US8802024B2 | Biochip and manufacturing method thereof | Performing Operations; Transporting | 0 | Active |
| US11988467B2 | Liquid-cooling heat dissipation plate with pin-fins and enclosed liquid cooler having the same | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US12305122B1 | Device to recycle material and related systems and methods | Emerging Cross-Sectional Technologies | 0 | Active |
| US12194831B2 | Vehicle water-cooling heat sink plate having fin sets with different fin pitch distances | Performing Operations; Transporting | 0 | Active |
| US12120845B2 | Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same | Electricity | 0 | Active |
| US11310916B1 | Metal circuit on polymer composite substrate surface and method for manufacturing the same | Electricity | 0 | Active |
| US11081421B2 | IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips | Electricity | 0 | Active |
| US11037857B1 | IGBT module with heat dissipation structure having copper layers of different thicknesses | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.