Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board
US11312858B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 22, 2018 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Jan 7, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2371/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.