Fumito Suzuki
13Patents
5h-index
24Co-inventors
66Inventor score
Filing activity: May 22, 1996 → Nov 22, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713794B2 | Lateral semiconductor device | Electricity | 42 | Expired |
| US6150702A | Lateral high-voltage semiconductor device having an outwardly extended electrode | Electricity | 19 | Expired |
| US5821031A | Photosensitive solder resist ink, printed circuit board and production thereof | Electricity | 13 | Expired |
| US5982015A | High breakdown voltage semiconductor device | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6677622B2 | Semiconductor device having insulated gate bipolar transistor with dielectric isolation structure | Electricity | 5 | Expired |
| US8927972B2 | Current-amplifying transistor device and current-amplifying, light-emitting transistor device | Electricity | 2 | Active |
| US6133617A | High breakdown voltage semiconductor device | Emerging Cross-Sectional Technologies | 2 | Expired |
| US11866580B2 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Chemistry; Metallurgy | 0 | Active |
| US9468109B2 | Method for fabricating wiring board | Electricity | 0 | Active |
| US12173151B2 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Chemistry; Metallurgy | 0 | Active |
| US9128375B2 | Resin composition for masks | Electricity | 0 | Active |
| US11312858B2 | Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board | Chemistry; Metallurgy | 0 | Active |
| US9458284B2 | Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.