Patent · US Active

Loading apparatus and physical vapor deposition apparatus

US11315768B2 · kind B2 · utility

0Cited by

3References

18Claims

0Family size

Assignee

BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. · CN

Inventors

Xuewei Wu · Beijing, CN
Tong Wang · Beijing, CN
Boyu DONG · Beijing, CN
Jun Zhang · Beijing, CN
Bingliang GUO · Beijing, CN
Jun Wang · Nanhu, CN
Henan Zhang · Albany, US
Baogang Xu · Beijing, CN
Huaichao MA · Beijing, CN
Shaohui Liu · Changchun, CN
Kangning Zhao · Beijing, CN
Yujie GENG · Beijing, CN
Qingxuan Wang · Beijing, CN
Yaxin CUI · Beijing, CN

Key dates

Filing date	Jun 15, 2018
Grant date	Apr 26, 2022
Priority date	—
Expiry date	Jul 12, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present disclosure provides a loading apparatus and a physical vapor deposition (PVD) apparatus. The loading apparatus includes a pedestal configured to support a workpiece; and a first support member placed on the pedestal and configured to push up a cover ring when the pedestal is at an operation position to prevent an overlapping portion of a cover ring and the workpiece from contacting each other. In the loading apparatus and the PVD apparatus, the first support member supports the cover ring, such that the cover ring does not contact the workpiece, thereby reducing stress forces on the workpiece by external components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.