Apparatus for transferring wafer, method for transferring wafer using the same with three sensors
US11315817B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Nov 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54493
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.