System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
US11315819B2 · kind B2 · utility
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Key dates
| Filing date | May 21, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | May 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2007
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method may include providing a substrate on a clamp, and directing radiation from an illumination source to the substrate when the substrate is disposed on the clamp during substrate processing, wherein the radiation is characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.