Substrate suction-holding structure and substrate transfer robot
US11315823B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2019 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | May 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate suction-holding structure includes a conductive pad main body including an annular contact portion and a bottom wall portion closing a first vacuum chamber bottom surface surrounded by the contact portion, a conductive blade main body including an upper surface and a second vacuum chamber formed by depressing the upper surface, a conductive support column provided either on the second vacuum chamber or on the pad main body, causing the contact portion to be further on an upper side than the upper surface, and swingably supporting the pad main body with respect to the second vacuum chamber, a cover secured to the blade main body and covering the second vacuum chamber, and a suction path extending from the first vacuum chamber and passing through the bottom wall portion, the second vacuum chamber, and the blade main body in this order, the suction path connected to a vacuum source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.