Method for fastening a semiconductor chip on a substrate, and electronic component

US11315898B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Klaus Mueller · Nittendorf, DE
• Andreas Ploessl · Regensburg, DE
• Mathias Wendt · Eschborn, DE

Key dates

• Filing date: Jun 6, 2018
• Grant date: Apr 26, 2022
• Expiry date: Jun 6, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15747
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.