Patent · US Active

Semiconductor packaging structure having antenna module

US11316247B2 · kind B2 · utility

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0References

8Claims

0Family size

Assignee

SJ Semiconductor (Jiangyin) Corporation · CN

Inventors

Yenheng Chen · Jiangyin, CN
Chengchung Lin · Jiangyin, CN
Chengtar Wu · Jiangyin, CN
Jangshen Lin · Jiangyin, CN

Key dates

Filing date	Dec 5, 2018
Grant date	Apr 26, 2022
Priority date	—
Expiry date	Feb 24, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure provides a semiconductor packaging structure having an antenna module, comprising: a substrate having a first surface and a second surface opposite to the first surface; a redistribution layer located on the first surface; a metal bump electrically connected with the redistribution layer; a semiconductor chip electrically connected with the redistribution layer; a plastic packaging material layer packaging the metal bump and the semiconductor chip; and an antenna module located on the second surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.