Antenna packaging structure and method for forming the same
US11316252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0087
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an antenna packaging structure and a method for forming the same. The structure includes: a supporting substrate, a rewiring layer on the supporting substrate, a first antenna layer disposed on the rewiring layer, first metal feedline pillars disposed on the first antenna layer, a first packaging layer covering the first metal feedline pillars except exposing the top surfaces of the first metal feedline pillars; a second antenna layer on the first packaging layer, second metal feedline pillars, a second packaging layer covering the second metal feedline pillars except exposing the top surfaces of the second metal feedline pillars; a third antenna layer disposed on the second packaging layer, semiconductor chips connected to the rewiring layer, a metal bump disposed inside an opening in the rewiring layer, and a third packaging layer encapsulating the semiconductor chips and the metal bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.