Laser diode module
US11316322B2 · kind B2 · utility
2Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Mar 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/32341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode module is described herein. In accordance with a first exemplary embodiment, the laser diode module includes a first semiconductor die including at least one electronic switch, and a second semiconductor die including at least one laser diode. The second semiconductor die is bonded on the first semiconductor die using a chip-on-chip connecting technology to provide electrical connection between the electronic switch and the laser diode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.