Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
US11319397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2017 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Jul 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/012
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.