Patent · US Active

Package with integrated multi-tap impedance structure

US11322461B2 · kind B2 · utility

0Cited by

4References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Eduardo Schittler Neves · Olching, DE
Dan Popescu · Scottsdale, US

Key dates

Filing date	Aug 13, 2020
Grant date	May 3, 2022
Priority date	—
Expiry date	Aug 13, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package is disclosed. In one example the package comprises a carrier having a plurality of leads and an electronic component mounted on the carrier and comprising at least one pad. An impedance structure electrically couples the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.