Antenna-in-package with frequency-selective surface structure
US11322823B2 · kind B2 · utility
2Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2018 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Nov 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73267
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.