Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition
US11326246B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jul 27, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Jul 27, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C21/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method includes pre-warping a mask to induce strain when affixed to a substrate and ensure positive contact between the mask and the substrate during all phases of deposition. A film is applied to the mask at a rate sufficient to impart stress to the film faster than such stress can be released. Depending on the features defined by the mask, the pre-warping may be concentric, linear along one axis, or complex along a plurality of axes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.