Mechanical failure monitoring, detection, and classification in electronic assemblies

US11327050B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Kyle Yazzie · San Tan Valley, US
• Rajesh Kumar Neerukatti · Tempe, US
• Naga Sivakumar Yagnamurthy · Chandler, US
• David C. McCoy · Oviedo, US
• Pramod Malatkar · Chandler, US
• Frank P. Prieto · Gilbert, US

Key dates

• Filing date: Feb 20, 2018
• Grant date: May 10, 2022
• Expiry date: Aug 19, 2040

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2291/2697
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.