Photonic device and fabrication method thereof
US11327228B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | Jul 9, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Jul 13, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/34
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabricating a photonic device is provided. The method includes forming an optical coupler and a waveguide structure connected to the optical coupler over a semiconductor substrate; forming a metal-dielectric stack over the optical coupler and the waveguide structure; etching a hole in the metal-dielectric stack and vertically overlapping the optical coupler; and forming a protection layer on a sidewall and a bottom of the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.