Chien-Ying Wu
20Patents
1h-index
16Co-inventors
50Inventor score
Filing activity: Aug 16, 2013 → Feb 27, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11940659B2 | Optical integrated circuit structure including edge coupling protective features and methods of forming same | Electricity | 1 | Active |
| US11892678B2 | Photonic device and method of making same | Physics | 1 | Active |
| US10050103B2 | Method of forming semiconductor structures including metal insulator metal capacitor | Electricity | 0 | Active |
| US11476288B2 | Infrared image sensor component manufacturing method | Emerging Cross-Sectional Technologies | 0 | Active |
| US11327228B2 | Photonic device and fabrication method thereof | Physics | 0 | Active |
| US9871067B2 | Infrared image sensor component | Emerging Cross-Sectional Technologies | 0 | Active |
| US12050348B2 | Fiber to chip coupler and method of making the same | Physics | 0 | Active |
| US12169308B2 | Method of using fiber to chip coupler and method of making | Physics | 0 | Active |
| US11442230B2 | Silicon photonics coupling structure using an etch stop layer and methods of forming the same | Physics | 0 | Active |
| US12353034B2 | Optical integrated circuit structure including edge coupling protective features and method of forming same | Electricity | 0 | Active |
| US12153255B2 | Method of making photonic device | Physics | 0 | Active |
| US11175452B1 | Photonic device and fabrication method thereof | Physics | 0 | Active |
| US10453881B2 | Infrared image sensor component | Emerging Cross-Sectional Technologies | 0 | Active |
| US12072534B2 | Fiber to chip coupler and method of using | Physics | 0 | Active |
| US11740409B2 | Photonic device | Physics | 0 | Active |
| US12222542B2 | Photonic device on a semiconductor-on-insulator substrate and method of manufacturing thereof | Physics | 0 | Active |
| US9666660B2 | Semiconductor structures including metal insulator metal capacitor | Electricity | 0 | Active |
| US11892681B2 | Fiber to chip coupler and method of making the same | Physics | 0 | Active |
| US11848390B2 | Capping structures for germanium-containing photovoltaic components and methods of forming the same | Electricity | 0 | Active |
| US11532759B2 | Capping structures for germanium-containing photovoltaic components and methods of forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.