Patent · US Active

Method for producing a semiconductor device, and semiconductor device

US11329009B2 · kind B2 · utility

0Cited by

1References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Klockenkaemper · Lichtenau, DE
Martin Schulz · Elsdorf, DE
Ajay Kumar Tejaswi Konakanchi · Allagen, DE

Key dates

Filing date	Sep 4, 2020
Grant date	May 10, 2022
Priority date	—
Expiry date	Sep 4, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/585
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a semiconductor device includes providing a carrier configured to carry at least one semiconductor chip on a first side, and dispensing a polymer onto a second side situated opposite the first side in order to produce a sealing ring. The polymer is dispensed in such a way that the sealing ring produced has different heights perpendicular to the second side along its circumference.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.