Semiconductor package
US11329014B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2019 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | May 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes: a connection structure including one or more redistribution layers; a core structure disposed on a surface of the connection structure; a semiconductor chip disposed on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant disposed on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate disposed on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant, and the antenna substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.