Youngchan Ko
28Patents
2h-index
14Co-inventors
46Inventor score
Filing activity: Dec 4, 2019 → Jun 4, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11626367B2 | Semiconductor package | Electricity | 2 | Active |
| US11581284B2 | Semiconductor package with under-bump metal structure | Electricity | 2 | Active |
| US11569175B2 | Semiconductor package | Electricity | 2 | Active |
| US11562966B2 | Semiconductor package | Electricity | 1 | Active |
| US11329014B2 | Semiconductor package | Electricity | 1 | Active |
| US12040297B2 | Methods of manufacturing semiconductor packages | Electricity | 0 | Active |
| US11538737B2 | Semiconductor package | Electricity | 0 | Active |
| US12119305B2 | Semiconductor package | Electricity | 0 | Active |
| US11387225B2 | Fan-out type semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US12261105B2 | Semiconductor package | Electricity | 0 | Active |
| US11508639B2 | System in package (SiP) semiconductor package | Electricity | 0 | Active |
| US12159826B2 | Semiconductor package and method of manufacturing the semiconductor package | Electricity | 0 | Active |
| US11569158B2 | Semiconductor package | Electricity | 0 | Active |
| US12002798B2 | Fan-out type semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US11804444B2 | Semiconductor package including heat dissipation structure | Electricity | 0 | Active |
| US12394708B2 | Semiconductor package | Electricity | 0 | Active |
| US12183665B2 | Semiconductor package | Electricity | 0 | Active |
| US11935847B2 | Semiconductor package | Electricity | 0 | Active |
| US11398420B2 | Semiconductor package having core member and redistribution substrate | Electricity | 0 | Active |
| US12327826B2 | Semiconductor package | Electricity | 0 | Active |
| US12021020B2 | Semiconductor package | Electricity | 0 | Active |
| US11784129B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
| US12094817B2 | Semiconductor package | Electricity | 0 | Active |
| US11721620B2 | Fan-out type semiconductor package | Electricity | 0 | Active |
| US11916002B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.