Interconnection of copper surfaces using copper sintering material
US11329023B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
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Key dates
| Filing date | Aug 24, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Nov 21, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.