Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11331767B2 · kind B2 · utility
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23References
31Claims
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Key dates
| Filing date | Feb 1, 2019 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Feb 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad for chemical mechanical planarization comprises a material having a major surface, and asperities extending from the major surface, a ratio between a length and a width of each of the asperities greater than about 2:1, and an included angle between a leading surface of at least some asperities and the major surface greater than about 90°. Related pads, tools for chemical mechanical planarization, and related methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.