Aluminum compound and method for manufacturing semiconductor device using the same
US11332486B2 · kind B2 · utility
0Cited by
7References
11Claims
0Family size
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Key dates
| Filing date | Sep 9, 2019 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Jan 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.