Polishing slurry composition enabling implementation of multi-selectivity
US11332641B2 · kind B2 · utility
2Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Dec 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.