Advanced electrodeposited copper foil and copper clad laminate using the same
US11332839B2 · kind B2 · utility
0Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Sep 12, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.