Solid state cooler device

US11333413B2 · kind B2 · utility

Assignee

• NORTHROP GRUMMAN SYSTEMS CORPORATION · US

Inventors

• Robert M. Young · Ellicott City, US
• Aaron Ashley Hathaway · Baltimore, US
• John X. Przybysz · Penn Hills, US
• Gregory R. Boyd · Washington, US
• Zachary A. Stegen · Baltimore, US
• Edward R. Engbrecht · Hopewell Junction, US
• Aaron A. Pesetski · Gambrills, US
• Marc E. Sherwin · Catonsville, US

Key dates

• Filing date: Aug 28, 2019
• Grant date: May 17, 2022
• Expiry date: Aug 6, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02B30/00
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.