Comprehensive thermal mapping of an electronic circuit design through design simulation
US11334700B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Jun 27, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A simulation application can be executed by a computer system to develop thermal maps for an electronic architectural design. The simulation application can simulate the electronic architectural design over time. The simulation application can capture electronic signals from the electronic architectural design as the electronic architectural design is being simulated over time. The simulation application can determine power consumptions of the electronic architectural design over time from the electronic signals. The simulation application can derive temperatures of the electronic architectural design over time from the power consumptions. The simulation application can map the temperatures onto an electronic circuit design real estate of the electronic architectural design to develop the thermal maps over time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.