Power delivery device and method
US11335631B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 16, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Aug 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power delivery device includes a printed circuit board (PCB), a package device, and a chip connecting device. The PCB is configured to receive a first reference voltage and a second reference voltage. The package device is coupled to the PCB, and includes a bump array. The chip connecting device is coupled to the bump array of the package device, and configured to output a first supply voltage and a second supply voltage. The bump array includes first bumps and second bumps. The first bumps are configured to transmit the first reference voltage. The second bumps are configured to transmit the second reference voltage. The first bumps and the second bumps are disposed in parallel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.