Semiconductor chip fabrication and packaging methods thereof

US11335648B2 · kind B2 · utility

Assignees

• Semiconductor Manufacturing International (Shanghai) Corporation · CN
• Semiconductor Manufacturing International (Beijing) Corporation · CN

Inventors

• Li Hui Lu · Shanghai, CN
• Chun Chao Fei · Shanghai, CN
• Po Yuan Chiang · Shanghai, CN
• Ya Ping Wang · Shanghai, CN

Key dates

• Filing date: Nov 27, 2019
• Grant date: May 17, 2022
• Expiry date: Jan 30, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/35121
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for fabricating a semiconductor structure is provided. The method includes forming a semiconductor chip; providing a printed circuit board; and forming an adhesive layer between a connection surface of the semiconductor chip and the printed circuit board to bond the semiconductor chip with the printed circuit board. The semiconductor chip includes a plurality of cutting tracks intersected with each other to enclose an area having corner regions. The connection surface of the semiconductor chip includes a plurality of conductive bumps and a plurality of first openings are formed in each of the corner regions.