Gas cushion apparatus and techniques for substrate coating
US11338319B2 · kind B2 · utility
0Cited by
149References
21Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 28, 2019 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Aug 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a material layer on a substrate comprises loading a substrate into a printing zone of a coating system using a substrate handler, printing an organic ink material on a substrate while the substrate is located in the printing zone, transferring the substrate from the printing zone to a treatment zone of the coating system, treating the organic ink material deposited on the substrate in the treatment zone to form a film layer on the substrate, and removing the substrate from the treatment zone using the substrate handler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.