Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
US11339251B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 4, 2017 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.