Vacuum processing system with holding arrangement
US11339469B2 · kind B2 · utility
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5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2016 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides a holding arrangement. The holding arrangement for holding a substrate includes: a body portion having a first side; a dry adhesive material provided on the first side of the body portion; a seal surrounding the dry adhesive material and configured to provide a vacuum region on the first side, wherein the dry adhesive material is provided in the vacuum region; and a conduit to evacuate the vacuum region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.