Substrate cleaning apparatus and substrate cleaning method using the same
US11342203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Feb 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate cleaning apparatus includes a support inside a chamber to hold a substrate, a first supply source inside the chamber that includes a first nozzle along a first direction and facing an upper surface of the support, the first nozzle to spray polymer and solvent onto the substrate to form a coating, and a second nozzle at an oblique angle to the first direction and facing an edge of the support to inject a hot gas toward the coating to volatilize the solvent, a second supply source inside the chamber and having a third nozzle facing the upper surface of the support to inject a peeling treatment to the coating to peel the coating from the substrate, and a third supply source inside the chamber and facing a lower surface of the support to inject the hot gas to heat a second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.