Device for measuring thickness of specimen and method for measuring thickness of specimen
US11346659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2021 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Mar 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring the thickness of a specimen, according to an embodiment, can measure the thickness of a specimen having multiple layers in a contactless and non-destructive manner. In addition, when the refractive indexes of materials forming the respective layers are already known, the thicknesses of the respective layers can be integrally measured through differences in reflection times of terahertz waves with respect to the respective layers of the specimen, thereby measuring the thickness of the specimen, such that the time taken for measuring the thickness of the specimen can be reduced. Furthermore, when the refractive indexes of the materials forming the respective layers are not known, the refractive indexes of the respective layers can be measured through differences in transmission times and reflection times of terahertz waves with respect to the respective layers of the specimen, and at the same time, the thicknesses of the respective layers can be measured through differences in transmission times or reflection times of terahertz waves with respect to the respective layers of the specimen, so that the thickness of various specimens can be measured. As such, the p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.