Method for fabricating a detection device comprising a step of transferring and direct bonding of a thin layer provided with a getter material
US11346722B2 · kind B2 · utility
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12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Dec 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/184
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a method for fabricating a detection device 1, comprising the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.