Frank Fournel
43Patents
3h-index
65Co-inventors
62Inventor score
Filing activity: Sep 23, 2004 → May 4, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7579259B2 | Simplified method of producing an epitaxially grown structure | Electricity | 17 | Active |
| US7264996B2 | Method for separating wafers bonded together to form a stacked structure | Electricity | 5 | Expired |
| US9427948B2 | Manufacturing a flexible structure by transfers of layers | Emerging Cross-Sectional Technologies | 4 | Active |
| US7544547B2 | Method for producing a support for the growth of localised elongated nanostructures | Emerging Cross-Sectional Technologies | 3 | Active |
| US8828244B2 | Method for building a substrate holder | Electricity | 2 | Active |
| US8530331B2 | Process for assembling substrates with low-temperature heat treatments | Emerging Cross-Sectional Technologies | 2 | Active |
| US10438921B2 | Method for direct bonding with self-alignment using ultrasound | Electricity | 2 | Active |
| US9922954B2 | Method for performing direct bonding between two structures | Electricity | 2 | Active |
| US10497609B2 | Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates | Electricity | 1 | Active |
| US9321636B2 | Method for producing a substrate holder | Electricity | 1 | Active |
| US7863156B2 | Method of producing a strained layer | Electricity | 1 | Active |
| US7655578B2 | Method for nanostructuring of the surface of a substrate | Performing Operations; Transporting | 0 | Active |
| US11562899B2 | Method for transferring thin layers | Electricity | 0 | Active |
| US11710653B2 | Method for manufacturing a handle substrate intended for temporary bonding of a substrate | Electricity | 0 | Active |
| US8501026B2 | Method for making a planar membrane | Performing Operations; Transporting | 0 | Active |
| US11694991B2 | Method for transferring chips | Electricity | 0 | Active |
| US11569115B2 | Temporary bonding method | Electricity | 0 | Active |
| US11081463B2 | Bonding method with electron-stimulated desorption | Electricity | 0 | Active |
| US8382933B2 | Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water | Electricity | 0 | Active |
| US12227679B2 | Surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate | Electricity | 0 | Active |
| US11054402B2 | Method and device for checking a bond between two substrates | Physics | 0 | Active |
| US11244971B2 | Method of transferring a thin film from a substrate to a flexible support | Electricity | 0 | Active |
| US10100400B2 | Method for recycling a substrate holder | Electricity | 0 | Active |
| US9076841B2 | Double layer transfer method | Emerging Cross-Sectional Technologies | 0 | Active |
| US11482567B2 | LED emissive display device and method for producing such a device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.