Laser processing apparatus and laser processing method
US11348793B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 11, 2017 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Jan 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54453
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus has a laser beam applying unit for applying a laser beam to a workpiece held on a chuck table. The laser beam applying unit includes an elliptical spot forming member for changing the spot shape of a pulsed laser beam into an elliptical shape and making the major axis of the elliptical beam spot parallel to a feeding direction, a diffractive optical element for branching the pulsed laser beam having the elliptical beam spot obtained by the elliptical spot forming member, into a plurality of pulsed laser beams each having an elliptical beam spot whose major axis extends in the feeding direction, and a condensing lens for condensing each of the pulsed laser beams branched by the diffractive optical element to the workpiece in such a manner that the major axes of the elliptical beam spots of the pulsed laser beams branched are partially overlapped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.