Photonic chip features for fiber attachment
US11353659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Mar 30, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4239
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.