Mario J. Ciminelli
15Patents
7h-index
13Co-inventors
63Inventor score
Filing activity: Mar 16, 1989 → Mar 30, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8246141B2 | Insert molded printhead substrate | Emerging Cross-Sectional Technologies | 28 | Active |
| US8496317B2 | Metalized printhead substrate overmolded with plastic | Performing Operations; Transporting | 18 | Active |
| US5157973A | Pressure sensor with integral overpressure protection | Physics | 18 | Expired |
| US7862147B2 | Inclined feature to protect printhead face | Performing Operations; Transporting | 15 | Active |
| US6568276B1 | Strain gauge based sensor with improved linearity | Physics | 12 | Expired |
| US8438730B2 | Method of protecting printhead die face | Emerging Cross-Sectional Technologies | 12 | Active |
| US8118406B2 | Fluid ejection assembly having a mounting substrate | Emerging Cross-Sectional Technologies | 8 | Active |
| US7276394B2 | Large area flat image sensor assembly | Electricity | 4 | Expired |
| US8690296B2 | Inkjet printhead with multi-layer mounting substrate | Performing Operations; Transporting | 4 | Active |
| US8721042B2 | Inkjet printhead with layered ceramic mounting substrate | Performing Operations; Transporting | 1 | Active |
| US8662640B2 | Corrosion protected flexible printed wiring member | Emerging Cross-Sectional Technologies | 1 | Active |
| US7810910B2 | Fluid-ejecting device with simplified connectivity | Performing Operations; Transporting | 1 | Active |
| US11353659B2 | Photonic chip features for fiber attachment | Physics | 0 | Active |
| US8430474B2 | Die mounting assembly formed of dissimilar materials | Performing Operations; Transporting | 0 | Active |
| US8887393B2 | Fabrication of an inkjet printhead mounting substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.