Nanoparticle matrix for backside heat spreading
US11355414B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 27, 2019 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Feb 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.