Dielets on flexible and stretchable packaging for microelectronics
US11355443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Jul 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication between the dielets is achieved with various direct-bonding or hybrid bonding techniques that achieve high conductor count and very fine pitch on flexible substrates. An example process uses high-density interconnects direct-bonded or hybrid bonded between standard interfaces of dielets to create a flexible microelectronics package. In another example, a process uses high-density interconnections direct-bonded between native interconnects of the dielets to create the flexible microelectronics packages, without the standard interfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.