Patent · US Active

Interconnect core

US11355458B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Jackson Chung Peng Kong · Merang, MY
Bok Eng Cheah · Air Itam, MY
Ping Ping Ooi · Butterworth, MY
Kooi Chi Ooi · Air Itam, MY

Key dates

Filing date	Nov 27, 2017
Grant date	Jun 7, 2022
Priority date	—
Expiry date	Nov 27, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30111
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device and method of utilizing conductive thread interconnect cores. Substrates using conductive thread interconnect cores are shown. Methods of creating a conductive thread interconnect core are shown.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.