Patent · US Active

Semiconductor die and semiconductor package

US11355485B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Western Digital Technologies, Inc. · US

Inventors

Yazhou Zhang · Manhasset, US
Chin-Tien Chiu · Taichung, TW
Shineng Ma · Shanghai, CN

Key dates

Filing date	Mar 13, 2020
Grant date	Jun 7, 2022
Priority date	—
Expiry date	Jul 11, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor die is provided. The semiconductor die includes: at least one complementary metal oxide semiconductor (CMOS) circuit module electrically coupled to at least one memory die, the at least one memory die being separated from the semiconductor die; and a controller module electrically coupled to the CMOS circuit module and configured to control the at least one CMOS circuit module and the at least one memory die. A semiconductor package is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.