Patent · US Active

Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave

US11355838B2 · kind B2 · utility

2Cited by

27References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ashutosh Baheti · Munich, DE
Marwa Abdel-Aziz · Munich, DE
Mustafa Doga Dogan · Cambridge, US
Muhammad Tayyab Qureshi · Neubiberg, DE
Saverio Trotta · Hersbruck, DE
Maciej Wojnowski · Munich, DE

Key dates

Filing date	Mar 18, 2019
Grant date	Jun 7, 2022
Priority date	—
Expiry date	Dec 13, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q19/005
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.